Wafer Level Chip Scale Package (WLCSP) Redistribution Layer from China
Thin-film redistribution layer substrate for WLCSP technology, rerouting die I/O pads to peripheral solder bumps. Falls under HTS 8542.90.00.00 as specialized parts of electronic integrated circuits enabling advanced fan-out packaging at wafer level.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Include RDL layer thickness and material specs (copper/PI); ESD-safe handling mandatory; declare as semiconductor WLP parts explicitly