8542.90.00.00/TSOP-48 Memory IC Lead Frame Assembly/Japan

TSOP-48 Memory IC Lead Frame Assembly from Japan

Pre-formed lead frame assembly in TSOP-48 package configuration for flash memory integrated circuits, providing electrical connections for the die. Falls under HTS 8542.90.00.00 as it is a specialized part of electronic integrated circuits used in the packaging process before die attachment.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Include material composition certificates (copper alloy specs); watch for tariff shifts if lead frames include attached dies; use anti-tarnish packaging to prevent oxidation