TSOP-48 Memory IC Lead Frame Assembly from Germany
Pre-formed lead frame assembly in TSOP-48 package configuration for flash memory integrated circuits, providing electrical connections for the die. Falls under HTS 8542.90.00.00 as it is a specialized part of electronic integrated circuits used in the packaging process before die attachment.
Duty Rate — Germany → United States
0%
Rate breakdown
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Include material composition certificates (copper alloy specs); watch for tariff shifts if lead frames include attached dies; use anti-tarnish packaging to prevent oxidation