TSOP-48 Memory IC Lead Frame Assembly from China
Pre-formed lead frame assembly in TSOP-48 package configuration for flash memory integrated circuits, providing electrical connections for the die. Falls under HTS 8542.90.00.00 as it is a specialized part of electronic integrated circuits used in the packaging process before die attachment.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Include material composition certificates (copper alloy specs); watch for tariff shifts if lead frames include attached dies; use anti-tarnish packaging to prevent oxidation