8542.90.00.00/Silicon Die Spacer Wafer/Japan

Silicon Die Spacer Wafer from Japan

Thin silicon wafer with through-holes used as spacers in 3D IC stacking for precise die-to-die alignment. Classified under HTS 8542.90.00.00 as parts of electronic integrated circuits for vertical integration packaging.

Duty Rate — Japan → United States

Rate breakdown

9903.05.860%Universal product exemption (U.S. note 52(b))

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Import Tips

• Total thickness variation specs; plasma clean certification; handle with wafer shippers