8542.90.00.00/Silicon Die Spacer Wafer/China

Silicon Die Spacer Wafer from China

Thin silicon wafer with through-holes used as spacers in 3D IC stacking for precise die-to-die alignment. Classified under HTS 8542.90.00.00 as parts of electronic integrated circuits for vertical integration packaging.

Duty Rate — China → United States

50%

Rate breakdown

9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Total thickness variation specs; plasma clean certification; handle with wafer shippers

Silicon Die Spacer Wafer from China — Import Duty Rate | HTS 8542.90.00.00