Silicon Die Spacer Wafer from Canada

Thin silicon wafer with through-holes used as spacers in 3D IC stacking for precise die-to-die alignment. Classified under HTS 8542.90.00.00 as parts of electronic integrated circuits for vertical integration packaging.

Duty Rate — Canada → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter

Import Tips

Total thickness variation specs; plasma clean certification; handle with wafer shippers