QFN-64 Package Substrate with Solder Balls from Mexico
Organic substrate in QFN-64 format pre-attached with BGA-style solder balls for quad flat no-lead IC packaging. Classified under HTS 8542.90.00.00 as parts of electronic integrated circuits, serving as the interconnect base for IC die bonding and ball grid array connections.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Certify solder ball composition (lead-free SAC305 typical); ensure flatness specs meet JEDEC standards for declaration; avoid contamination with moisture barrier bags