8542.90.00.00/QFN-64 Package Substrate with Solder Balls/Germany

QFN-64 Package Substrate with Solder Balls from Germany

Organic substrate in QFN-64 format pre-attached with BGA-style solder balls for quad flat no-lead IC packaging. Classified under HTS 8542.90.00.00 as parts of electronic integrated circuits, serving as the interconnect base for IC die bonding and ball grid array connections.

Duty Rate — Germany → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Certify solder ball composition (lead-free SAC305 typical); ensure flatness specs meet JEDEC standards for declaration; avoid contamination with moisture barrier bags