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8542.90.00.00/Gold Wire Bonding Wedge Tool/Mexico

Gold Wire Bonding Wedge Tool from Mexico

Tungsten carbide wedge tool for thermosonic gold wire bonding of IC leads to die pads. Falls under HTS 8542.90.00.00 as specialized parts for electronic integrated circuit assembly processes.

Duty Rate — Mexico → United States

0%

Rate breakdown

9903.05.860%Universal product exemption (U.S. note 52(b))
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Import Tips

• Ultrasound frequency matching docs; wire diameter range spec; ultrasonic horn alignment tolerance

Gold Wire Bonding Wedge Tool from Mexico — Import Duty Rate | HTS 8542.90.00.00