Gold Wire Bonding Wedge Tool from Germany
Tungsten carbide wedge tool for thermosonic gold wire bonding of IC leads to die pads. Falls under HTS 8542.90.00.00 as specialized parts for electronic integrated circuit assembly processes.
Duty Rate — Germany → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Ultrasound frequency matching docs; wire diameter range spec; ultrasonic horn alignment tolerance