Gold Wire Bonding Wedge Tool from China
Tungsten carbide wedge tool for thermosonic gold wire bonding of IC leads to die pads. Falls under HTS 8542.90.00.00 as specialized parts for electronic integrated circuit assembly processes.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Ultrasound frequency matching docs; wire diameter range spec; ultrasonic horn alignment tolerance