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8542.90.00.00/BGA Heat Spreader Lid for Processor ICs/Japan

BGA Heat Spreader Lid for Processor ICs from Japan

Precision-machined copper or aluminum lid assembly with thermal interface material for BGA integrated circuit packages. Recognized under HTS 8542.90.00.00 as a part of electronic integrated circuits, providing heat dissipation for high-power CPU/GPU dies.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.05.860%Universal product exemption (U.S. note 52(b))
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Import Tips

• Provide thermal performance data sheets; declare surface finish (Ni/Au plating); check for ITAR restrictions on high-performance computing parts

BGA Heat Spreader Lid for Processor ICs from Japan — Import Duty Rate | HTS 8542.90.00.00