BGA Heat Spreader Lid for Processor ICs from Germany
Precision-machined copper or aluminum lid assembly with thermal interface material for BGA integrated circuit packages. Recognized under HTS 8542.90.00.00 as a part of electronic integrated circuits, providing heat dissipation for high-power CPU/GPU dies.
Duty Rate — Germany → United States
0%
Rate breakdown
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Provide thermal performance data sheets; declare surface finish (Ni/Au plating); check for ITAR restrictions on high-performance computing parts