Kingston KSM32ED8/32ME 256GB DDR4 Enterprise DRAM Chip
Ultra-high density 256GB DDR4 enterprise DRAM IC for next-generation servers and AI supercomputers. Easily qualifies for HTS 8542.32.0036 with extreme capacity exceeding 1 gigabit by orders of magnitude. Features 3DS stacking technology for maximum bandwidth density.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| π¨π³China | Free | +50.0% | 50% |
| π²π½Mexico | Free | β | Free |
| π¨π¦Canada | Free | β | Free |
| π©πͺGermany | Free | β | Free |
| π―π΅Japan | Free | β | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If hybrid DRAM/non-volatile cache memory
Memory with persistent storage functions classifies differently.
If parts of other ADP machines
Different ADP subsections for specific computer parts.
If for data recording and reproducing apparatus
Recording equipment ICs have separate instrument classifications.
Not sure which classification is right?
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Import Tips & Compliance
β’ Declare advanced packaging technology details; comply with advanced computing export licensing; validate thermal dissipation specs for high-density chips
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