Samsung K4B2G1646G DRAM Chip from Canada
This is a 1Gb DDR3 SDRAM integrated circuit with 512Mx4 organization, designed for high-speed memory applications in computers and consumer electronics. It falls under HTS 8542.32.00.32 because it is a dynamic read-write random access memory (DRAM) chip with capacity over 512 megabits but not exceeding 1 gigabit. These chips are essential for temporary data storage in devices requiring fast read/write operations.
Duty Rate — Canada → United States
Rate breakdown
Import Tips
• Verify exact memory density via datasheet to confirm HTS 8542.32.00.32 classification; slight variations may shift to adjacent subheadings
• Include RoHS compliance certificates and full technical specifications in documentation to avoid customs reclassification
• Package in anti-static materials and declare value based on silicon wafer content to prevent undervaluation penalties