New

Ask Wove anything about tariffs.

Try Tariff Assistant

Samsung K4B2G1646G-BCK0 256Mb DDR3 DRAM Chip from Japan

This is a 256 megabit DDR3 synchronous dynamic random access memory (DRAM) integrated circuit designed for high-performance computing applications. It falls under HTS 8542.32.0024 because it is a dynamic read-write random access memory with capacity over 128 megabits but not over 256 megabits. Commonly used in laptops and embedded systems for temporary data storage.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter

Import Tips

• Verify exact memory capacity via datasheet to confirm 8542.32.0024 classification; exceeding 256Mb shifts to higher subheading

• Include RoHS compliance certificates and full technical specs in documentation to avoid customs reclassification

• Package in anti-static materials to prevent damage; declare as 'monolithic ICs' not memory modules to stay in 8542