Qualcomm Snapdragon 8 Gen 2 SoC

The Qualcomm Snapdragon 8 Gen 2 is a high-performance system on chip featuring an integrated CPU, GPU, modem, and AI engine on a single die for premium smartphones. It falls under HTS 8542.31.00.70 as a processor and controller combined with memories, logic circuits, and other circuits in SoC form. This classification applies to advanced mobile SoCs with multiple integrated functions.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+50.0%50%
🇲🇽MexicoFreeFree
🇨🇦CanadaFreeFree
🇩🇪GermanyFreeFree
🇯🇵JapanFreeFree

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8542.39.00Same rate: 50%

If primarily a memory chip with minimal processing

Shifts to other integrated circuits if not qualifying as processors/controllers with combined functions.

8473.30.51.00Same rate: 50%

If imported as part of a complete computer motherboard assembly

Classified as parts of computers when sold as assembled motherboard components rather than standalone ICs.

8541.41.00.00Lower: 25% vs 50%

If for light-emitting diodes (LED) driver SoCs

LED drivers fall under photosensitive semiconductor devices, not general processors.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Verify SoC specifications match 8542.31 criteria via manufacturer datasheets for Customs classification

Include detailed technical documentation showing integration of processor, memory, and other circuits

Avoid misclassification as discrete processors (8542.31.00.00) by proving multi-function SoC design

Related Products under HTS 8542.31.00.70

Apple A17 Pro SoC

Apple's A17 Pro System on Chip powers iPhone 15 Pro models with a 6-core CPU, 6-core GPU, neural engine, and 5G modem all integrated on one chip. Classified under HTS 8542.31.00.70 for SoCs combining processors, controllers, memories, and other circuits. Essential for high-end mobile computing devices.

MediaTek Dimensity 9300 SoC

MediaTek Dimensity 9300 SoC features all-big-core CPU architecture, ray-tracing GPU, and Wi-Fi 7 modem for premium Android flagships. Falls under HTS 8542.31.00.70 due to integration of processors, converters, amplifiers, and timing circuits on one chip. Popular in mid-to-high-end smartphones.

AMD Ryzen Embedded V2000 SoC

AMD Ryzen Embedded V2000 series SoC delivers Zen 2 cores, Radeon graphics, and I/O controllers for industrial PCs and gaming machines. HTS 8542.31.00.70 applies to this processor+memory+logic integrated circuit design. Targets embedded computing applications.

Raspberry Pi RP2040 SoC

Raspberry Pi RP2040 is a dual-core Arm Cortex-M0+ microcontroller SoC with programmable I/O, 264KB SRAM, and flash controller for DIY electronics. Qualifies under HTS 8542.31.00.70 as it combines processors, memory, logic, and timing circuits. Popular for maker projects and embedded systems.

Samsung Exynos 2400 SoC

Samsung Exynos 2400 is a flagship mobile SoC with octa-core CPU, advanced GPU, NPU for AI, and integrated 5G connectivity for Galaxy smartphones. It qualifies for HTS 8542.31.00.70 as a system on chip integrating multiple processor types, memory controllers, and logic circuits. Used in high-volume consumer electronics.

NVIDIA Tegra Orin SoC

NVIDIA Tegra Orin is an automotive-grade SoC with 254 TOPS AI performance, combining CPU, GPU, PVA, and deep learning accelerator for ADAS and robotics. Classified HTS 8542.31.00.70 for its multi-circuit integration including logic, memory, and converters. Designed for embedded vehicle systems.