LED Eutectic Bonding Fixtures from Japan
Gold-tin alloy fixtures for eutectic die bonding of high-power LEDs during assembly. Precision parts for light-emitting diode manufacturing under HTS 8541.90.00. Maintain 280°C bonding temperature uniformity.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Thermal profile data showing eutectic bonding parameters essential
• AuSn alloy composition must be documented precisely
• Avoid jewelry alloy or general fixture classifications