Diode Clipping Lead Formers from Japan
Specialized tooling dies for forming axial leads on semiconductor diodes after packaging. Production parts for diode manufacturing under HTS 8541.90.00. Create precise bend radii for circuit board mounting.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Include die drawings showing diode lead bend specifications
• Prove exclusive use in semiconductor packaging lines
• Avoid machine tool classification under Chapter 84