High-Temperature Diac Die from Japan
Unmounted diac dice rated for 175°C operation in automotive ignition systems. Falls under 8541.30.00.40 as semiconductor wafers for diac devices with high-temperature junction specs. Critical for engine timing circuits.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Automotive qualification docs (AEC-Q101) essential; declare junction temperature specs; use automotive-grade anti-static packaging