Fast-Recovery Triac Wafer
Unmounted wafers optimized for fast turn-off triacs used in SMPS and inverters. Specifically under 8541.30.00.40 due to triac gate structure and recovery time specs <1μs. Enables high-frequency AC switching.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for electric heating element controls
Triacs in complete heating controllers become heating element parts.
If automatic control system semiconductors
Dice designed for control loops classify under control instruments.
If electrical machines accessory components
Triac dice sold as motor starter parts shift classification.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Include turn-off time test data sheets; ensure wafer handling frames declared separately; watch for epitaxial pricing premiums
Related Products under HTS 8541.30.00.40
Silicon Carbide Thyristor Wafer
Unmounted silicon carbide wafers designed for fabricating high-power thyristors used in industrial motor controls and power grids. These wafers meet the subheading criteria for thyristor chips under 8541.30.00.40 as they are unmounted semiconductor dice in wafer form prior to dicing. They enable high-voltage switching applications due to their superior thermal management.
Gallium Nitride Diac Wafer
Unmounted GaN wafers for diac production, used in high-frequency switching circuits and surge protection devices. Classified under 8541.30.00.40 as unmounted semiconductor wafers specifically for diac devices which are bidirectional trigger thyristors. Their wide bandgap properties enable efficient operation in power electronics.
1200V Silicon Triac Die
Unmounted silicon dice rated at 1200V for triac fabrication, essential for AC motor controls and lighting dimmers. These individual semiconductor chips qualify under 8541.30.00.40 as unmounted triac dice before packaging. Triacs provide bidirectional switching for household appliances.
High-Power Thyristor Wafer (4-inch)
4-inch unmounted silicon wafers for manufacturing high-power thyristors used in HVDC transmission systems. Specifically classified under 8541.30.00.40 due to thyristor-specific epitaxial layers and doping. These enable megawatt-scale power control applications.
SiC Triac Chip (Unmounted)
Individual unmounted silicon carbide chips for triac devices operating at 600V-1200V in EV power electronics. Falls under 8541.30.00.40 as unmounted triac semiconductor dice with bidirectional gate control structure. Superior to silicon in high-temperature performance.
Industrial Diac Wafer (6-inch)
6-inch silicon wafers engineered for diac production in industrial dimming and timing circuits. Classified specifically under 8541.30.00.40 for unmounted diac wafers with symmetrical breakover voltage characteristics. Supports precise AC phase control applications.