SiC Triac Chip (Unmounted)
Individual unmounted silicon carbide chips for triac devices operating at 600V-1200V in EV power electronics. Falls under 8541.30.00.40 as unmounted triac semiconductor dice with bidirectional gate control structure. Superior to silicon in high-temperature performance.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If assembled into complete power semiconductor modules
Modules containing triac dice become static converters rather than discrete dice.
If diodes rather than triac structures
Unidirectional dice classify under separate diode semiconductor provision.
If used as test/measurement semiconductor components
Dice for instrument calibration fall under parts of measuring instruments.
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Import Tips & Compliance
• Certify substrate purity >99.999% for classification support; include gate trigger current specifications; beware of partial processing that might trigger 'mounted' classification
Related Products under HTS 8541.30.00.40
Silicon Carbide Thyristor Wafer
Unmounted silicon carbide wafers designed for fabricating high-power thyristors used in industrial motor controls and power grids. These wafers meet the subheading criteria for thyristor chips under 8541.30.00.40 as they are unmounted semiconductor dice in wafer form prior to dicing. They enable high-voltage switching applications due to their superior thermal management.
Gallium Nitride Diac Wafer
Unmounted GaN wafers for diac production, used in high-frequency switching circuits and surge protection devices. Classified under 8541.30.00.40 as unmounted semiconductor wafers specifically for diac devices which are bidirectional trigger thyristors. Their wide bandgap properties enable efficient operation in power electronics.
1200V Silicon Triac Die
Unmounted silicon dice rated at 1200V for triac fabrication, essential for AC motor controls and lighting dimmers. These individual semiconductor chips qualify under 8541.30.00.40 as unmounted triac dice before packaging. Triacs provide bidirectional switching for household appliances.
High-Power Thyristor Wafer (4-inch)
4-inch unmounted silicon wafers for manufacturing high-power thyristors used in HVDC transmission systems. Specifically classified under 8541.30.00.40 due to thyristor-specific epitaxial layers and doping. These enable megawatt-scale power control applications.
Industrial Diac Wafer (6-inch)
6-inch silicon wafers engineered for diac production in industrial dimming and timing circuits. Classified specifically under 8541.30.00.40 for unmounted diac wafers with symmetrical breakover voltage characteristics. Supports precise AC phase control applications.
800A Thyristor Dice Sheet
Pre-diced sheet of 800A-rated thyristor dice on tape for high-current traction applications. Each unmounted die qualifies under 8541.30.00.40 as thyristor semiconductor chips. Used in railway and marine propulsion systems.