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Silicon NPN Power Transistor Wafer from China

Unmounted silicon wafer containing thousands of NPN bipolar junction transistor dice, used in power amplification circuits for automotive and industrial applications. Classified under HTS 8541.29.00.40 as unmounted chips, dice, and wafers of transistors other than photosensitive types. These are raw semiconductor substrates prior to dicing and packaging.

Duty Rate — China → United States

50%

Rate breakdown

9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter

Import Tips

• Provide detailed wafer specifications including diameter, doping levels, and resistivity to avoid misclassification as finished devices

• Include certificates of origin and material composition analysis to qualify for preferential tariff treatment under trade agreements

• Use anti-static, vacuum-sealed packaging to prevent damage; declare as 'unmounted wafers' explicitly on commercial invoice