8541.10.00.40/Silicon Schottky Diode Wafer/Japan

Silicon Schottky Diode Wafer from Japan

A large silicon wafer containing thousands of unmounted Schottky diode chips used in power rectification and high-frequency switching applications. These wafers are produced through semiconductor fabrication processes and diced into individual dice post-import. Classified under HTS 8541.10.0040 as unmounted chips, dice, and wafers specifically for diodes other than photosensitive or LED types.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Verify wafer specifications including diameter, doping type, and diode characteristics match HTS 8541.10.0040 criteria for unmounted diode wafers

• Provide detailed manufacturing process documentation to customs to distinguish from mounted or assembled semiconductor devices

• Avoid common pitfalls by ensuring cleanroom packaging to prevent contamination claims during inspection