Glass Epoxy Backplane PCB for Storage Arrays from Japan
High-layer backplane PCB with orthogonal connectors on glass-impregnated base for enterprise NAS/SAN storage systems. HTS 8534.00.00.20 for 8+ conductor layers in rigid format supporting SAS/SATA. Enables data center storage scalability.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Press-fit connector specs distinguish backplanes from standard PCBs in rulings
• Declare connector count and pitch for backplane recognition
• Avoid 8471 if populated; strict bare board declaration needed