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8534.00.00.20/9-Layer RF Front-End PCB for 5G Smartphones/Mexico

9-Layer RF Front-End PCB for 5G Smartphones from Mexico

Compact 9-layer HDI PCB with glass microcloth base for smartphone RF modules handling mmWave signals. Classified under HTS 8534.00.00.20 for non-flexible glass impregnation and dense conductor layers. Critical for mobile connectivity.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• RF shield can/paste suggests completion; import unshielded

• Specify substrate (e.g

• 2116 glass) for impregnation proof