</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8534.00.00.20/9-Layer RF Front-End PCB for 5G Smartphones/Japan

9-Layer RF Front-End PCB for 5G Smartphones from Japan

Compact 9-layer HDI PCB with glass microcloth base for smartphone RF modules handling mmWave signals. Classified under HTS 8534.00.00.20 for non-flexible glass impregnation and dense conductor layers. Critical for mobile connectivity.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• RF shield can/paste suggests completion; import unshielded

• Specify substrate (e.g

• 2116 glass) for impregnation proof

9-Layer RF Front-End PCB for 5G Smartphones from Japan — Import Duty Rate | HTS 8534.00.00.20