8534.00.00.20/9-Layer RF Front-End PCB for 5G Smartphones/Japan

9-Layer RF Front-End PCB for 5G Smartphones from Japan

Compact 9-layer HDI PCB with glass microcloth base for smartphone RF modules handling mmWave signals. Classified under HTS 8534.00.00.20 for non-flexible glass impregnation and dense conductor layers. Critical for mobile connectivity.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• RF shield can/paste suggests completion; import unshielded

• Specify substrate (e.g

• 2116 glass) for impregnation proof