9-Layer RF Front-End PCB for 5G Smartphones from China
Compact 9-layer HDI PCB with glass microcloth base for smartphone RF modules handling mmWave signals. Classified under HTS 8534.00.00.20 for non-flexible glass impregnation and dense conductor layers. Critical for mobile connectivity.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• RF shield can/paste suggests completion; import unshielded
• Specify substrate (e.g
• 2116 glass) for impregnation proof