8534.00.00.20/4-Layer Power Distribution PCB for Telecom Base Stations/Japan

4-Layer Power Distribution PCB for Telecom Base Stations from Japan

Multilayer PCB with thick copper layers on glass-reinforced epoxy for high-current power distribution in 5G base stations. HTS 8534.00.00.20 applies due to rigid form, impregnated glass base, and 4 conductive layers handling RF power. Supports wireless infrastructure.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Highlight copper thickness (e.g

• 2oz/ft²) and layer count in invoices to justify multi-layer status

• Certify for telecom standards like NEBS for faster clearance in communications sector

• Avoid declaring as 'power supply boards' which could shift to 8504 transformers heading

4-Layer Power Distribution PCB for Telecom Base Stations from Japan — Import Duty Rate | HTS 8534.00.00.20