4-Layer Power Distribution PCB for Telecom Base Stations from Japan
Multilayer PCB with thick copper layers on glass-reinforced epoxy for high-current power distribution in 5G base stations. HTS 8534.00.00.20 applies due to rigid form, impregnated glass base, and 4 conductive layers handling RF power. Supports wireless infrastructure.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Highlight copper thickness (e.g
• 2oz/ft²) and layer count in invoices to justify multi-layer status
• Certify for telecom standards like NEBS for faster clearance in communications sector
• Avoid declaring as 'power supply boards' which could shift to 8504 transformers heading