4-Layer Power Distribution PCB for Telecom Base Stations from China
Multilayer PCB with thick copper layers on glass-reinforced epoxy for high-current power distribution in 5G base stations. HTS 8534.00.00.20 applies due to rigid form, impregnated glass base, and 4 conductive layers handling RF power. Supports wireless infrastructure.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Highlight copper thickness (e.g
• 2oz/ft²) and layer count in invoices to justify multi-layer status
• Certify for telecom standards like NEBS for faster clearance in communications sector
• Avoid declaring as 'power supply boards' which could shift to 8504 transformers heading