8534.00.00.20/12-Layer High-Density Interconnect PCB for AI Accelerators/Japan

12-Layer High-Density Interconnect PCB for AI Accelerators from Japan

Advanced HDI printed circuit with 12 layers of fine-line copper on glass epoxy base for GPU/TPU accelerator cards in AI computing. Qualifies for HTS 8534.00.00.20 as a non-flexible, glass-impregnated multi-layer board enabling microvia technology. Critical for machine learning hardware.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Submit Gerber files or stackup drawings proving 3+ layers and glass base to counter single-layer misclassification

• Ensure RoHS compliance declaration; heavy metals in conductors can flag environmental reviews