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8534.00.00.20/12-Layer High-Density Interconnect PCB for AI Accelerators/Germany

12-Layer High-Density Interconnect PCB for AI Accelerators from Germany

Advanced HDI printed circuit with 12 layers of fine-line copper on glass epoxy base for GPU/TPU accelerator cards in AI computing. Qualifies for HTS 8534.00.00.20 as a non-flexible, glass-impregnated multi-layer board enabling microvia technology. Critical for machine learning hardware.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Submit Gerber files or stackup drawings proving 3+ layers and glass base to counter single-layer misclassification

• Ensure RoHS compliance declaration; heavy metals in conductors can flag environmental reviews

12-Layer High-Density Interconnect PCB for AI Accelerators from Germany — Import Duty Rate | HTS 8534.00.00.20