12-Layer High-Density Interconnect PCB for AI Accelerators from Canada
Advanced HDI printed circuit with 12 layers of fine-line copper on glass epoxy base for GPU/TPU accelerator cards in AI computing. Qualifies for HTS 8534.00.00.20 as a non-flexible, glass-impregnated multi-layer board enabling microvia technology. Critical for machine learning hardware.
Duty Rate — Canada → United States
60%
Rate breakdown
9903.03.1450%Articles the product of Canada as provided in subdivision (b)(3) of U.S. note 51 to this subchapter
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit Gerber files or stackup drawings proving 3+ layers and glass base to counter single-layer misclassification
• Ensure RoHS compliance declaration; heavy metals in conductors can flag environmental reviews