8514.39.10.00/Reflow Soldering Oven for PCB Assembly/Japan

Reflow Soldering Oven for PCB Assembly from Japan

This industrial reflow oven uses controlled infrared heating and convection for soldering surface-mount components onto printed circuit boards during PCB manufacturing. It falls under HTS 8514.39.10.00 as it is specifically designed for the heat treatment process essential to printed circuit assembly. The oven maintains precise temperature profiles to ensure reliable solder joints without damaging components.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

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Import Tips

• Verify the oven's design documentation proves principal use for PCB manufacturing to qualify under this specific subheading

• Include detailed technical specs showing temperature control for soldering profiles in commercial invoice and packing list

• Avoid misclassification as general industrial ovens (8514.90); prepare binding ruling requests if end-use documentation is unclear