Of a kind used solely or principally for the manufacture of printed circuits or printed circuit assemblies
Industrial or laboratory electric furnaces and ovens (including those functioning by induction or dielectric loss); other industrial or laboratory equipment for the heat treatment of materials by induction or dielectric loss; parts thereof: > Other furnaces and ovens: > Other: > Of a kind used solely or principally for the manufacture of printed circuits or printed circuit assemblies
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8514.39.10.00
Reflow Soldering Oven for PCB Assembly
This industrial reflow oven uses controlled infrared heating and convection for soldering surface-mount components onto printed circuit boards during PCB manufacturing. It falls under HTS 8514.39.10.00 as it is specifically designed for the heat treatment process essential to printed circuit assembly. The oven maintains precise temperature profiles to ensure reliable solder joints without damaging components.
Infrared PCB Reflow Furnace
A conveyorized infrared furnace designed exclusively for reflow soldering in printed circuit board production lines. It provides uniform heating via IR lamps for precise SMT component attachment and is dedicated to PCB assembly processes. Classified under HTS 8514.39.10.00 due to its specialized role in printed circuit heat treatment.
Convection Reflow Oven for SMT Lines
Multi-zone forced convection reflow oven optimized for surface-mount technology assembly on printed circuit boards. It ensures nitrogen atmosphere control and precise thermal profiling for high-volume PCB production. This equipment is principally for printed circuit manufacturing, qualifying for HTS 8514.39.10.00.
Batch Reflow Oven for PCB Prototyping
Compact batch-style reflow oven for small-lot printed circuit board soldering in electronics manufacturing facilities. It features programmable profiles for lead-free and leaded solder pastes, dedicated to circuit assembly. Falls under HTS 8514.39.10.00 for its principal printed circuit use.
Dielectric Heating Oven for PCB Preheating
Dielectric loss heating oven used for uniform preheating of printed circuit boards prior to soldering operations. It employs RF energy for rapid, volumetric heating specific to PCB materials and assembly. Classified in HTS 8514.39.10.00 for printed circuit manufacturing applications.
Induction Preheater for PCB Soldering Lines
Induction heating station designed solely for preheating printed circuit boards in high-volume soldering conveyor systems. It provides contactless, rapid heating optimized for PCB thermal mass. Meets HTS 8514.39.10.00 criteria for printed circuit manufacturing equipment.
Vapor Phase Reflow System for PCBs
Closed-loop vapor phase soldering system using saturated vapor for precise reflow of printed circuit board assemblies. The inert vapor environment prevents oxidation during soldering, dedicated to PCB production. Specifically for printed circuit manufacture under HTS 8514.39.10.00.
PCB Curing Oven for Solder Mask
Tunnel oven for thermal curing of liquid solder mask applied to printed circuit boards during manufacturing. It provides controlled UV and thermal profiles specific to PCB coating processes. Principal use for printed circuits qualifies it for HTS 8514.39.10.00.
Selective Solder Preheater Oven
Dedicated preheating oven for printed circuit boards in selective soldering systems, ensuring thermal uniformity before wave soldering of through-hole components. Designed exclusively for mixed-technology PCB assembly. HTS 8514.39.10.00 classification for printed circuit equipment.
Inline PCB Thermal Profiler Oven
Inline heating oven with integrated thermal profiling for real-time monitoring during printed circuit board reflow soldering. Ensures compliance with IPC standards for PCB assembly quality. Specialized for circuit manufacturing under HTS 8514.39.10.00.