Induction Preheater for PCB Soldering Lines

Induction heating station designed solely for preheating printed circuit boards in high-volume soldering conveyor systems. It provides contactless, rapid heating optimized for PCB thermal mass. Meets HTS 8514.39.10.00 criteria for printed circuit manufacturing equipment.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8514.90Lower: 10% vs 35%

If for preheating metal components in electronics assembly

Non-PCB specific induction equipment falls under other parts.

8515.90.20.00Higher: 36.6% vs 35%

If when used as soldering station component rather than standalone

Accessories for soldering machines classify separately from furnaces.

8456.30Lower: 12.4% vs 35%

If industrial use in PCB drilling preheat applications

Machine tool accessories for PCB fabrication shift classification.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Include induction coil specifications tuned for FR4 PCB substrates

Document integration with reflow soldering conveyors for principal use proof

Differentiate from general induction heaters serving multiple industries

Related Products under HTS 8514.39.10.00

Reflow Soldering Oven for PCB Assembly

This industrial reflow oven uses controlled infrared heating and convection for soldering surface-mount components onto printed circuit boards during PCB manufacturing. It falls under HTS 8514.39.10.00 as it is specifically designed for the heat treatment process essential to printed circuit assembly. The oven maintains precise temperature profiles to ensure reliable solder joints without damaging components.

Infrared PCB Reflow Furnace

A conveyorized infrared furnace designed exclusively for reflow soldering in printed circuit board production lines. It provides uniform heating via IR lamps for precise SMT component attachment and is dedicated to PCB assembly processes. Classified under HTS 8514.39.10.00 due to its specialized role in printed circuit heat treatment.

Convection Reflow Oven for SMT Lines

Multi-zone forced convection reflow oven optimized for surface-mount technology assembly on printed circuit boards. It ensures nitrogen atmosphere control and precise thermal profiling for high-volume PCB production. This equipment is principally for printed circuit manufacturing, qualifying for HTS 8514.39.10.00.

Batch Reflow Oven for PCB Prototyping

Compact batch-style reflow oven for small-lot printed circuit board soldering in electronics manufacturing facilities. It features programmable profiles for lead-free and leaded solder pastes, dedicated to circuit assembly. Falls under HTS 8514.39.10.00 for its principal printed circuit use.

Dielectric Heating Oven for PCB Preheating

Dielectric loss heating oven used for uniform preheating of printed circuit boards prior to soldering operations. It employs RF energy for rapid, volumetric heating specific to PCB materials and assembly. Classified in HTS 8514.39.10.00 for printed circuit manufacturing applications.

Vapor Phase Reflow System for PCBs

Closed-loop vapor phase soldering system using saturated vapor for precise reflow of printed circuit board assemblies. The inert vapor environment prevents oxidation during soldering, dedicated to PCB production. Specifically for printed circuit manufacture under HTS 8514.39.10.00.