PCB Curing Oven for Solder Mask from Japan
Tunnel oven for thermal curing of liquid solder mask applied to printed circuit boards during manufacturing. It provides controlled UV and thermal profiles specific to PCB coating processes. Principal use for printed circuits qualifies it for HTS 8514.39.10.00.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document UV wavelength and thermal profiles matching PCB coating specifications
• Include material safety data for curing agents processed
• Distinguish from general coating ovens by printed circuit board focus