PCB Curing Oven for Solder Mask from Japan
Tunnel oven for thermal curing of liquid solder mask applied to printed circuit boards during manufacturing. It provides controlled UV and thermal profiles specific to PCB coating processes. Principal use for printed circuits qualifies it for HTS 8514.39.10.00.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document UV wavelength and thermal profiles matching PCB coating specifications
• Include material safety data for curing agents processed
• Distinguish from general coating ovens by printed circuit board focus