Convection Reflow Oven for SMT Lines from Japan
Multi-zone forced convection reflow oven optimized for surface-mount technology assembly on printed circuit boards. It ensures nitrogen atmosphere control and precise thermal profiling for high-volume PCB production. This equipment is principally for printed circuit manufacturing, qualifying for HTS 8514.39.10.00.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Submit end-user contracts or production line specs showing PCB manufacturing dedication
• Document nitrogen purging and zone control features specific to soldering processes
• Beware of dual-use claims; customs may require proof of principal PCB application