Convection Reflow Oven for SMT Lines from Japan
Multi-zone forced convection reflow oven optimized for surface-mount technology assembly on printed circuit boards. It ensures nitrogen atmosphere control and precise thermal profiling for high-volume PCB production. This equipment is principally for printed circuit manufacturing, qualifying for HTS 8514.39.10.00.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit end-user contracts or production line specs showing PCB manufacturing dedication
• Document nitrogen purging and zone control features specific to soldering processes
• Beware of dual-use claims; customs may require proof of principal PCB application