Convection Reflow Oven for SMT Lines from China
Multi-zone forced convection reflow oven optimized for surface-mount technology assembly on printed circuit boards. It ensures nitrogen atmosphere control and precise thermal profiling for high-volume PCB production. This equipment is principally for printed circuit manufacturing, qualifying for HTS 8514.39.10.00.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Submit end-user contracts or production line specs showing PCB manufacturing dedication
• Document nitrogen purging and zone control features specific to soldering processes
• Beware of dual-use claims; customs may require proof of principal PCB application