Batch Reflow Oven for PCB Prototyping from Japan
Compact batch-style reflow oven for small-lot printed circuit board soldering in electronics manufacturing facilities. It features programmable profiles for lead-free and leaded solder pastes, dedicated to circuit assembly. Falls under HTS 8514.39.10.00 for its principal printed circuit use.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include software screenshots of PCB-specific reflow profiles in import documentation
• Certify equipment tonnage and zone capacity suitable only for circuit boards
• Distinguish from general curing ovens by emphasizing soldering conveyor design