Batch Reflow Oven for PCB Prototyping from Japan
Compact batch-style reflow oven for small-lot printed circuit board soldering in electronics manufacturing facilities. It features programmable profiles for lead-free and leaded solder pastes, dedicated to circuit assembly. Falls under HTS 8514.39.10.00 for its principal printed circuit use.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include software screenshots of PCB-specific reflow profiles in import documentation
• Certify equipment tonnage and zone capacity suitable only for circuit boards
• Distinguish from general curing ovens by emphasizing soldering conveyor design