Batch Reflow Oven for PCB Prototyping from China
Compact batch-style reflow oven for small-lot printed circuit board soldering in electronics manufacturing facilities. It features programmable profiles for lead-free and leaded solder pastes, dedicated to circuit assembly. Falls under HTS 8514.39.10.00 for its principal printed circuit use.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include software screenshots of PCB-specific reflow profiles in import documentation
• Certify equipment tonnage and zone capacity suitable only for circuit boards
• Distinguish from general curing ovens by emphasizing soldering conveyor design