Dielectric Heating Plasma Cleaner for Circuit Boards from Japan
This plasma cleaner employs dielectric loss heating to activate gases for surface cleaning of bare printed circuit boards prior to component assembly. Designed exclusively for the heat treatment step in PCB manufacturing, it fits HTS 8514.32.10.00 criteria for specialized industrial equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Label equipment clearly as 'for PCB manufacturing only' and include process flow diagrams in entry docs
• Conduct binding ruling requests for hybrid plasma systems to confirm dielectric loss primacy
• Avoid misclassification by distinguishing from general surface treatment machines in 8424