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Dielectric Heating Plasma Cleaner for Circuit Boards from Japan

This plasma cleaner employs dielectric loss heating to activate gases for surface cleaning of bare printed circuit boards prior to component assembly. Designed exclusively for the heat treatment step in PCB manufacturing, it fits HTS 8514.32.10.00 criteria for specialized industrial equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Label equipment clearly as 'for PCB manufacturing only' and include process flow diagrams in entry docs

Conduct binding ruling requests for hybrid plasma systems to confirm dielectric loss primacy

Avoid misclassification by distinguishing from general surface treatment machines in 8424