Dielectric Heating Plasma Cleaner for Circuit Boards from China

This plasma cleaner employs dielectric loss heating to activate gases for surface cleaning of bare printed circuit boards prior to component assembly. Designed exclusively for the heat treatment step in PCB manufacturing, it fits HTS 8514.32.10.00 criteria for specialized industrial equipment.

Duty Rate — China → United States

35%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

Import Tips

Label equipment clearly as 'for PCB manufacturing only' and include process flow diagrams in entry docs

Conduct binding ruling requests for hybrid plasma systems to confirm dielectric loss primacy

Avoid misclassification by distinguishing from general surface treatment machines in 8424