Dielectric Barrier Discharge Plasma Generator for PCB Surface Activation from Japan
Atmospheric pressure plasma generator using dielectric barrier discharge for activating PCB surfaces to improve adhesion before lamination. Principally for printed circuit production lines, covered by HTS 8514.32.10.00 plasma heat treatment equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Demonstrate non-vacuum dielectric mechanism via technical literature
• Include customer contracts specifying PCB production end-use
• Watch for reclassification to 8424 if emphasized as mechanical treater