Electron Beam Printed Circuit Reflow Oven from China
This industrial electron beam furnace is designed specifically for reflow soldering of surface-mount components on printed circuit boards during PCB assembly. It uses electron beam heating via dielectric loss to precisely melt solder paste without oxidizing the circuits. Classified under HTS 8514.31.10.00 as it is used solely for printed circuit manufacturing.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Verify equipment certification for cleanroom compatibility and electron beam safety standards (IEC 61010)
• Include detailed technical specs proving exclusive use for PCB manufacturing to avoid reclassification
• Prepare FCC compliance documentation for electromagnetic emissions from electron beam generation