Of a kind used solely or principally for the manufacture of printed circuits or printed circuit assemblies
Industrial or laboratory electric furnaces and ovens (including those functioning by induction or dielectric loss); other industrial or laboratory equipment for the heat treatment of materials by induction or dielectric loss; parts thereof: > Other furnaces and ovens: > Electron beam furnaces: > Of a kind used solely or principally for the manufacture of printed circuits or printed circuit assemblies
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8514.31.10.00
Electron Beam Printed Circuit Reflow Oven
This industrial electron beam furnace is designed specifically for reflow soldering of surface-mount components on printed circuit boards during PCB assembly. It uses electron beam heating via dielectric loss to precisely melt solder paste without oxidizing the circuits. Classified under HTS 8514.31.10.00 as it is used solely for printed circuit manufacturing.
PCB Electron Beam Sintering Furnace
Specialized furnace using electron beam technology for sintering conductive pastes on ceramic substrates and flexible printed circuits. Provides uniform high-temperature processing essential for multilayer PCB fabrication. Meets HTS 8514.31.10.00 criteria for equipment principally used in printed circuit assembly.
High-Vacuum Electron Beam PCB Baking Oven
Vacuum chamber oven employing electron beam heating for moisture removal and polymer curing in printed circuit board fabrication. Ensures contamination-free processing critical for high-reliability electronics. Specifically designed for printed circuit manufacturing qualifying for HTS 8514.31.10.00.
Electron Beam Multilayer PCB Lamination Furnace
Precision furnace for electron beam heating during multilayer printed circuit board lamination, bonding prepregs and copper foils under controlled pressure. Essential for high-density interconnect (HDI) PCB production. Classifies under HTS 8514.31.10.00 due to principal use in printed circuit manufacturing.
Electron Beam Flex Circuit Annealing Oven
Specialized annealing furnace using electron beam technology for stress relief in flexible printed circuits after etching and plating processes. Prevents warping in polyimide and polyester substrates. HTS 8514.31.10.00 applies as equipment used principally for printed circuit production.
Electron Beam Solder Mask Curing Furnace
Industrial furnace designed for rapid curing of liquid photoimageable solder mask on printed circuit boards using electron beam dielectric heating. Achieves full polymerization without thermal degradation of underlying circuitry. Specifically for printed circuit manufacturing per HTS 8514.31.10.00.
Electron Beam Via Filling Furnace for PCBs
Furnace optimized for electron beam reflow of conductive epoxy in microvia filling during high-density PCB fabrication. Ensures void-free filling critical for HDI interconnect reliability. Classifies under HTS 8514.31.10.00 for printed circuit manufacturing equipment.
Electron Beam Copper Plating Post-Bake Oven
Post-plating bake oven using electron beam heating to stabilize electrodeposited copper on printed circuit boards, relieving hydrogen embrittlement. Critical step in PCB plating line for multilayer boards. HTS 8514.31.10.00 classification for printed circuit production equipment.