Wafer Polisher Slurry Distribution Ring from Mexico
Perforated ring that evenly distributes chemical slurry across semiconductor wafer surface during polishing operations. Critical for uniform material removal rates. Classified 8487.90.00 as mechanical process part.
Duty Rate — Mexico → United States
13.9%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify hole pattern and material resistant to chemical slurries
• Document even distribution performance data
• Common error: plastic parts to Chapter 39