Wafer Polisher Slurry Distribution Ring from Japan
Perforated ring that evenly distributes chemical slurry across semiconductor wafer surface during polishing operations. Critical for uniform material removal rates. Classified 8487.90.00 as mechanical process part.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify hole pattern and material resistant to chemical slurries
• Document even distribution performance data
• Common error: plastic parts to Chapter 39