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8487.90.00/Wafer Polisher Slurry Distribution Ring/Japan

Wafer Polisher Slurry Distribution Ring from Japan

Perforated ring that evenly distributes chemical slurry across semiconductor wafer surface during polishing operations. Critical for uniform material removal rates. Classified 8487.90.00 as mechanical process part.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify hole pattern and material resistant to chemical slurries

• Document even distribution performance data

• Common error: plastic parts to Chapter 39

Wafer Polisher Slurry Distribution Ring from Japan — Import Duty Rate | HTS 8487.90.00