Wafer Polisher Slurry Distribution Ring from Germany
Perforated ring that evenly distributes chemical slurry across semiconductor wafer surface during polishing operations. Critical for uniform material removal rates. Classified 8487.90.00 as mechanical process part.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify hole pattern and material resistant to chemical slurries
• Document even distribution performance data
• Common error: plastic parts to Chapter 39